FIELD: physics.
SUBSTANCE: semiconductor plate with metal pads for forming indium microcontacts is coated with a layer of positive reversible photoresist which, after exposure through a photomask with a pattern of the microcontacts, is subjected to special heat treatment (image reversal), followed by blanket exposure and development; an indium layer is sprayed onto the obtained negative-profile photoresist mask; the photoresist layer is then dissolved with simultaneous peeling of the indium layer in the gaps between microcontacts (explosion process), leaving the latter on the metal pads.
EFFECT: simple technique and shorter time for making indium microcontacts by lift-off photolithography.
6 dwg
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Authors
Dates
2014-07-20—Published
2013-01-09—Filed