METHOD OF PRODUCING MICROELECTRONIC UNIT ON PLASTIC BASE Russian patent published in 2016 - IPC H01L21/77 H01L21/782 

FIELD: manufacturing technology.

SUBSTANCE: invention relates to production of high-power multichip modules, microassemblies with internal mounting of components. Proposed method feature is that when producing a microelectronic unit on a plastic base prior to installation of unpacked chips and chip components the round plate along its outer part is connected to a support metal ring, a thin layer of an organosilicon polymer is applied. Unpacked chips and chip components are installed basing on the previously formed topological pattern, sealed with the organosilicon polymer to get the polymer thickness equal to the height of the ring. Base - round metal plate is removed, an additional round metal plate is fixed on the back side of the microelectronic unit. Switching is performed by vacuum deposition of metals or by photolithography. Dielectric layer is applied, then the second layer of metal coating, a protective layer from the organosilicon polymer. Brazing paste is applied on output sites of the microelectronic unit, the additional round metal plate with the ring is removed - the microelectronic unit is cut off the processing tooling.

EFFECT: provided are reduced labor input, expansion of functional capabilities; higher reliability of microelectronic assemblies.

1 cl, 1 dwg