METHOD FOR DEPACKAGING INTEGRATED MICROCIRCUITS Russian patent published in 2016 - IPC H01L21/66 

FIELD: chemistry.

SUBSTANCE: method for depackaging integrated microcircuits for further realisation of tests is characterised by the fact that performed is technological preparation of products to be tested from selection of consignments of arbitrary functional classes, including visual control for absence of mechanical damage, identification of product by determination of package type and its internal structure, characteristics of crystal, its geometrical dimensions, presence and thickness of protective coatings, metallisation layers, electric characteristics, component composition of package, obtained data are used to determine area, direction, depth, profile of further performed package thinning, and/or depackaging, realised by plasma-chemical, or plasma, or chemical etching, with selection of template from chemically stable rubber with window, specifying required zone of depackaging, or mechanical or laser methods, or their combination, with further washing of tested product in ultrasonic bath with solvents and its output visual, functional, and parametric control.

EFFECT: invention makes it possible to carry out depackaging of electronic microcircuit crystal with preservation of their workability.

9 cl, 4 tbl, 1 ex