FIELD: process engineering.
SUBSTANCE: invention relates to making of structures for high-sensitivity multicomponent solid-state image converters, that is, multicomponent photo receivers. Proposed method comprises making of control plate, connecting of control plate with carrier plate, processing of control plate rear side, exposing of contact openings, separating to chips and forming of external terminals. In exposing of contact openings, first openings are etched in control plate silicon layer above terminal area that are larger than terminal area sizes. Note here that alkaline etchants are used. Then, terminal openings are exposed in dielectric layer above terminal area, mainly, by reactive ion etching using fluorine-substituted hydrocarbons as etchants.
EFFECT: reliable exposure of terminal openings, higher yield.
5 dwg
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