METHOD OF MAKING PRINTED-CIRCUIT BOARDS Russian patent published in 2016 - IPC H05K3/02 H05K3/24 

FIELD: radio engineering, communication.

SUBSTANCE: invention relates to radio electronics, microwave engineering and can be used to make printed-circuit boards, as well as microstrip lines with electroconductive structures made from a different metal. The printed-circuit boards are made by depositing onto an insulated substrate surface a layer of a metal complex in the form of a thin film from a solution or by evaporation in a vacuum chamber (sublimation) from a solid phase. The complex component of the compound is decomposed by a laser on a circuit layout with simultaneous diffusion of the metal into the substrate. Metal tracks of the circuit lay out, which are linked to the substrate surface, are obtained. After the laser scanning cycle, the remaining metal complex is removed by washing the substrate with a solvent.

EFFECT: simple process of making printed-circuit boards with a pattern of an electroconductive circuit without using laborious photolithography and screen printing methods, improved environmental safety of the process.

3 cl