FIELD: physics.
SUBSTANCE: sensor is formed on a polished plate which is cut from an ingot of n-type ultrapure silicon, for which the method comprises consecutively performing the first chemical washing of the plate in a surfactant solution containing complexons, forming a layer of silicon oxide by thermal oxidation in an atmosphere of dry oxygen with the addition of chlorine-containing components, implanting p-type impurity ions into the working side of the plate and n-type impurity ions into the non-working side of the plate at a temperature not lower than 50°C with the implantation energy of not more than 200 keV and with an implantation dose of not more than 1000 mcC/cm2, repeating chemical washing of the plate in a surfactant solution containing complexons, forming a layer of silicon oxide by thermal oxidation in an atmosphere of dry oxygen with the addition of chlorine-containing components, repeating the implantation of p-type impurity ions into the working side of the plate and n-type impurity ions into the non-working side of the plate at a temperature not higher than 25°C with the implantation energy of not more than 200 keV, depositing an aluminium layer on both sides of the plate, forming an ohmic contact by burning aluminium and depositing a passivating coating on the working side of the plate, and then performing two-step post-implantation annealing.
EFFECT: producing a detector element with higher sensitivity, based on the planar technology.
15 cl, 8 dwg
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Authors
Dates
2016-02-27—Published
2014-12-03—Filed