FIELD: chemistry.
SUBSTANCE: method of diffraction periodic microstructure making based on porous silicon includes forming specified diffraction periodic microstructure with help of ions implantation of noble or transition metals through surface mask with energy of 5-100 keV. At that, exposure dose provides concentration of metal atoms in irradiated substrate of silicon of 2.5·1020-6.5·1023 atoms/cm3. Ion beam current density is 2·1012-1·1014 ion/(cm2·s) at substrate temperature during exposure of 15-450 °C.
EFFECT: technical result consists in possibility of making diffraction periodic microstructure based on porous silicon with nanoparticles of different metals in vacuum.
1 cl, 20 dwg
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Authors
Dates
2016-08-10—Published
2015-03-25—Filed