FIELD: physics.
SUBSTANCE: method includes forming on the surface of an initial monocrystalline silicon substrate a layer of porous silicon via ion implantation of silver or cobalt ions with energy of 10-50 keV, a radiation dose which provides concentration of embedded metal atoms in the irradiated substrate of 3·1020-6·1023 atoms/cm3, current density of the ion beam of 2·1012-1·1014 ions/cm2 s with substrate temperature during irradiation of 20-400°C.
EFFECT: obtaining layers of porous silicon directly on the surface of monocrystalline silicon by ion implantation while excluding high-temperature annealing of the obtained articles from the process.
9 dwg, 3 ex
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Authors
Dates
2015-04-10—Published
2014-04-09—Filed