FIELD: manufacturing technology.
SUBSTANCE: invention can be used for installation and removal of, at least, one semiconductor integrated circuit. Summary of invention consists in fact, that integrated circuit housing consists of flange and substrate with arrangement of, at least, one integrated circuit and substrate on one side of flange, flange is made of electric and heat-conducting material, wherein integrated circuit composite housing comprises, at least, one cooling device, as well as electric isolation between terminals of, at least, one integrated circuit and, at least, one cooling device.
EFFECT: enabling possibility of highly efficient heat removal.
15 cl, 2 dwg
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