FIELD: electricity.
SUBSTANCE: invention relates to production of radioelectronic components. Method of producing multilayer radioelectronic components involves forming an adhesive, conductive and protective layer. It consists of sputtering a solid metal film, forming a pattern of conductors and contact pads by photolithography, etching a protective layer, depositing a conducting layer. Tantalum and chromium are used as adhesion and protective layers respectively. In lithography, a thick-film photoresist is used; also, a dielectric can be formed as a layer. Metal-metal or metal-dielectric layers can alternate. Photoresist is dried in at least two stages. After the thick-film photoresist drying step, its surface is levelled.
EFFECT: simplification of microwave modules production technology due to possibility of formation in a single cycle with resistors: capacitors, inductors, microwave transitions, microcoaxial lines with air dielectric and air bridges.
5 cl, 25 dwg
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