FIELD: chemistry.
SUBSTANCE: invention relates to a composition for chemical-mechanical polishing (CMP). The composition contains (A) mineral particles, organic particles, or their mixture or their composite, where particles are in the form of a cocoon, (B) amphiphilic non-ion surfactant based on polyoxymethylen-polyoxypropylene alkyl simple ether in the form of a mixture of molecules containing on average an alkyl group having 10 to 16 carbon atoms, 5 to 20 oxyethylene monomer units (b21), and 2 to 8 oxypropylene monomer units (b22) in a random distribution, (C) carbonate or hydrocarbonate salt, (D) alcohol, and (M) an aquatic medium. A method for producing semiconductor devices is also disclosed, comprising chemical-mechanical polishing a substrate used in the semiconductor industry, in the presence of a CMP composition, and using a CMP composition.
EFFECT: improving the compound properties.
16 cl, 4 dwg, 2 tbl, 2 ex
