FIELD: chemistry.
SUBSTANCE: invention relates to a chemical-mechanical polishing composition. Described is a chemical-mechanical polishing composition comprising (A) one or more compounds of formula (1) where the pairs of dashed lines in formula (1) either each represent a double bond or denote a single bond, where (i) when each pair of dashed lines in formula (1) denotes a double bond, one of R1 and R2 is hydrogen and the other of R1 and R2 is selected from the group consisting of chlorine, bromine, alkyl containing from three to six carbon atoms, benzoyl and -COOR3, where R3 is selected from the group consisting of alkyls containing from three to six carbon atoms, or R3 is a substituent containing a structural unit selected from the group consisting of -(CH2-CH2-O)n-H and -(CH2-CH2-O)n-CH3, where n, in each case, is an integer ranging from 1 to 15, or R1 and R2 are both independently selected from the group consisting of bromine and chlorine, and (ii) when each pair of dashed lines in formula (1) denotes a single bond, R1 and R2 are hydrogen, or one of R1 and R2 is hydrogen, and the other of R1 and R2 is selected from the group consisting of chlorine, bromine, alkyl containing from three to six carbon atoms, benzoyl and -COOR3, where R3 is selected from the group consisting of alkyls containing from three to six carbon atoms, or R3 is a substituent containing a structural unit selected from the group consisting of -(CH2-CH2-O)n-H and -(CH2-CH2-O)n-CH3, where n, in each case, is an integer ranging from 1 to 15, or R1 and R2 are both independently selected from the group consisting of bromine and chlorine, wherein the total amount of one or more compounds of formula (1) lies in the range of 0.0001 to 1 wt. % based on the total weight of the corresponding chemical-mechanical polishing composition, (B) inorganic particles, organic particles, or a composite thereof, or a mixture that is in the form of a cocoon, wherein the total amount of cations selected from the group consisting of magnesium and calcium is less than 1 part per million based on the total weight of the respective composition. Method for producing a semiconductor device and use of a compound of formula (1) are also described.
EFFECT: technical result: a chemical-technical polishing composition is disclosed, which is a stable dispersion in which phase separation does not occur.
16 cl, 4 dwg, 1 tbl
Authors
Dates
2018-10-12—Published
2014-07-01—Filed