ATTACHMENT POINT OF MICROCHANNEL PLATE INSIDE VACUUM HOUSING OF VACUUM PHOTOELECTRIC DEVICE Russian patent published in 2018 - IPC H01J9/36 H01J31/50 H01J43/00 

FIELD: instrument engineering.

SUBSTANCE: technical solution refers to vacuum photoelectronic devices, in which microchannel plates are used to amplify the photocurrent, and more particularly to the attachment point of the microchannel plate inside the vacuum housing of the vacuum photoelectronic device. Attachment point of the microchannel plate inside the vacuum housing of the vacuum photoelectric device comprises a microchannel plate with an electrically conductive input surface and an electrically conductive output surface held inside the vacuum housing, and also the first ring and the second ring. First ring is a metallized thrust ring that has a metallized surface contacting the electrically conductive input surface of the microchannel plate to provide electrical contact and axial fixation of the microchannel plate within the vacuum housing. Second ring is a metallized ring that is in electrical linear contact with the metalized thrust ring and has a metallized surface providing electrical contact supplied outside of the vacuum housing. Metallized surface of the metallized thrust ring, which contacts the electrically conductive input surface of the microchannel plate, is made as an outer cone with a vertex lying on the vertical axis of the said metallized thrust ring and a slope angle from 89°59'59'' up to 85°.

EFFECT: ensuring stable electrical supply of the microchannel plate and eliminating electrical breakdowns between its electrically conductive input surface and the metallized surface of the metallized thrust ring, decreasing the level of vibration of the microchannel plate and eliminating the acoustic noise perceived by the senses when the voltage is impulsively applied to the photocathode of the vacuum photoelectric device.

10 cl, 2 dwg