METHOD OF THE PHOTORESIST LAYER OBTAINING ON VARIOUS SUBSTRATES Russian patent published in 2018 - IPC G03F7/04 H01L21/27 

FIELD: lithography.

SUBSTANCE: invention relates to the field of lithography and refers the photoresist layer production method. Photoresist layer is obtained by aerosol spraying from the photoresist material solution. Simultaneously with the aerosol flow, at a flow rate of no more than 0.3 ml/min, a gas stream is formed above the substrate, at a rate exceeding the solution flow by no less than 4 orders of values. Application of the solution is performed iteratively in the form of separate microdroplets, having an average size on the substrate of less than 10 mcm and not forming a continuous layer in the individual iteration. During the layer formation, heating the substrate and/or the layer to a temperature of not more than 90 °C. To prepare the solution, using the solvent having a boiling point above 160 °C. Technical result consists in enabling of the possibility of photoresist material layers formation from 0.3 mcm to 200 mcm with maximum difference in layer thickness of less than 200 nm with the solution application to the substrate containing elements with a height difference exceeding the deposited layer thickness.

EFFECT: technical result consists in provision of the possibility of photoresist material layers formation.

1 cl, 7 dwg