FIELD: instrument engineering.
SUBSTANCE: invention relates to the integrated circuit parts positioning, placing and mounting methods in the housing, namely the integrated circuits (ICs) multi-crystal assemblies precise mounting with the crystal on to crystal installation, and can be used in rocket-space and ground instrument-making. In the integrated circuits multi-crystal assemblies precise mounting method with the crystal on to crystal installation, semiconductor crystals are sequentially positioned by the manual method using the graphic digital rulers.
EFFECT: increase in the multi-crystal assemblies mounting accuracy and quality.
1 cl, 3 dwg
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Authors
Dates
2018-07-05—Published
2017-09-12—Filed