FIELD: instrument engineering.
SUBSTANCE: invention relates to the integrated circuit parts positioning, placing and mounting methods in the housing, namely the integrated circuits (ICs) multi-crystal assemblies precise mounting with the crystal on to crystal installation, and can be used in rocket-space and ground instrument-making. In the integrated circuits multi-crystal assemblies precise mounting method with the crystal on to crystal installation, semiconductor crystals are sequentially positioned by the manual method using the graphic digital rulers.
EFFECT: increase in the multi-crystal assemblies mounting accuracy and quality.
1 cl, 3 dwg
Title | Year | Author | Number |
---|---|---|---|
METHOD FOR ASSEMBLING HYBRID MULTI-CHIP MODULES | 2020 |
|
RU2748393C1 |
METHOD FOR THREE-DIMENSIONAL MULTI-CHIP PACKAGING OF INTEGRATED MEMORY MICROCIRCUITS | 2019 |
|
RU2705229C1 |
METHOD FOR MANUFACTURING A MICROMODULE | 2021 |
|
RU2773807C1 |
MULTI-CHIP MICROCIRCUIT | 2017 |
|
RU2653183C1 |
MULTICHIP MODULE | 2019 |
|
RU2702705C1 |
METHOD OF MAKING SEMICONDUCTOR DEVICES | 2012 |
|
RU2511054C2 |
LARGE INTEGRAL CIRCUIT | 1990 |
|
RU2068602C1 |
INFORMATION STORAGE AND PROCESSING DEVICE (ISPD) | 2008 |
|
RU2398279C2 |
LARGE-SCALE INTEGRATED CIRCUIT (VERSION) | 1991 |
|
RU2006990C1 |
METHOD FOR PRODUCING THREE-DIMENSIONAL MULTICHIP MICROMODULE | 2005 |
|
RU2299497C2 |
Authors
Dates
2018-07-05—Published
2017-09-12—Filed