FIELD: technological processes.
SUBSTANCE: invention relates to the methods for cleaning hard surfaces from microparticles and can be used in order to remove microparticles from the surface of semiconductor wafers, as well as in space optics, high-resolution optics, photonics. Layer of the solution of an easily volatile solvent in water is applied to the surface, which is contaminated with microparticles, this layer is guided onto the beam of light, which is absorbed by the layer and a droplet is formed in the layer due to the light-induced centripetal concentration-capillary flow. Surface is cleaned by means of moving the droplet along it due to moving the light spot across the surface, by means of trapping the particles from the surface into the droplet volume with the indicated current and then removing using the micropipette of the collected microparticles together with the droplet volume.
EFFECT: simplicity of the method, no damage to the surface to be cleaned.
1 cl, 4 dwg
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