FIELD: electricity.
SUBSTANCE: invention relates to production of planar-type photoelectronic devices and can be used for connection of semiconductor billets of electrodes with end elements of photoelectronic devices. Electrode workpiece and end element of photoelectronic device are used, which are characterized by certain features, have, each, external and internal surfaces, are conjugated on their inner surfaces through thin antireflection layer and thus form connected assembly of electrode assembly. On the outer surface of the electrode billet or on the outer surface of the end element of the photoelectronic device, a working area is set, within which the output parameters of the photoelectronic device are normalized. Connecting assembly of electrode assembly is heated in preset mode. At that, on external surface of electrode billet positive electric potential is supplied through electric contact, which is provided within the area on external surface of electrode billet, orthogonal projection of which on surface with given working area intersects with said specified working area at not more than one point. And on the outer surface of the end element of the photoelectronic device there supplied is a negative electric potential through the surface electrical contact, which is provided within the area on the outer surface of the end element of the photoelectronic device, orthogonal projection of which on surface with given working area does not intersect said specified working area.
EFFECT: technical result is improvement of operational and technical characteristics of manufactured electrode assembly for photoelectronic device.
14 cl, 2 dwg
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Authors
Dates
2020-10-12—Published
2020-05-21—Filed