METHOD OF PREPARING MICROWIRES WITH GLASS SHELL FOR ELECTRICAL CONNECTION Russian patent published in 2018 - IPC C25D7/06 

FIELD: technological processes.

SUBSTANCE: invention relates to the field of electroplating and can be used in microelectronics for the manufacture of high-quality electrical contacts on microwires with a diameter of up to 40 microns with a glass shell of up to 15 microns, including variable cross-section, used for the manufacture of HMI, stress-sensitive sensors and magnetic labels. Method includes the complete local removal of the glass shell in the places of electrical contact creation without damaging the microwire cores by etching the glass shell of microwires with an etching gel, followed by washing with running water and electrochemical deposition of a copper sublayer with a thickness of 0.3–1 mcm on the etched contact areas using a pyrophosphate electrolyte, the following composition CuSO₄⋅5H₂O 1.0–2.5 g/l, K₄R₂O₇ 80–100 g/l, at a temperature of 15–30 °C, cathode current density of 1–2 A/dm², of time of 0.5–2 minutes.

EFFECT: microwires are prepared for subsequent soldering at a temperature of 190±5 °C POS61 soldering alloy, containing 39 % lead and 61 % tin, they have high wettability to molten solder alloy, adhesion, and provide reliable electrical contact with butt joints, lap joints and telescopic joints.

1 cl, 3 dwg