METHOD AND DEVICE FOR DETERMINING LOCAL MECHANICAL STRESS IN FILM ON SUBSTRATE Russian patent published in 2019 - IPC G01L1/00 

FIELD: measurement technology.

SUBSTANCE: invention relates to methods for measuring the mechanical properties of materials, including mechanical stresses, using optical instruments for stress analysis. During the implementation of the method, the local mechanical stress in the film on the substrate and the biaxial modulus of elasticity of the film and the substrate are determined. This approach includes the formation of a substrate thickness map, the determination of the substrate surface curvature, the formation of a film thickness map, and the calculation of mechanical stresses using the Stoney formula. Constants of the biaxial modulus of elasticity of the substrate and the film are determined by creating an overpressure. Amount of curvature of the surface is determined by the geometrical arrangement of the points of the relief.

EFFECT: improving the accuracy of determining mechanical stresses and expanding the list of measured mechanical properties of materials.

2 cl, 2 dwg