FIELD: physics.
SUBSTANCE: device includes electrodes, a monocrystalline silicon substrate with orientation of the working surface (111), on which there is a layered structure comprising a buffer layer of cubic silicon carbide and a layer of a hexagonal wide-band-gap semiconductor made from a group III metal nitride. According to the invention, the device further includes a layer of hexagonal silicon carbide lying on said layer of wide-band-gap semiconductor and epitaxially interfaced with it.
EFFECT: novel structure reduces the level of dislocations in the active region of the semiconductor device, enables to obtain a novel design of a device with two hard layers of silicon carbide and a soft layer of nitride, for example gallium nitride, in between.
4 cl, 6 dwg, 3 ex, 1 tbl
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Authors
Dates
2012-03-27—Published
2010-12-08—Filed