FIELD: test equipment.
SUBSTANCE: invention relates to testing equipment and can be used in tests for resistance of various types of complex functional integrated circuits (CFIC) to static destabilizing effects (SDE), including to the effect of ionizing radiations. In the method of carrying out tests for the resistance of the CFIC to the SDE, wherein the tests are carried out using a tester, before the test, the tested microcircuit (TM) is placed in a test rig, MI outputs are brought into contact with test fixture. Then, during the tests, the SDE is performed, perform the functional testing with measurement of the TM consumption current and inform the operator about the test results, at the end of the SDE, the obtained data are analysed, which results are used to conclude that the microcircuit resistance of the SDE is stable. Novelty is that analyser generators are used as a tester, at that at the stage of test preparation distribution of test vectors of functional testing (TVFT) is performed in channels of generators in compliance with testing scheme. Based on the TVFT, test parametric control vectors (TPCV) are generated, to SDE for the purpose of input control and evaluation of influence of test conditions for each microcircuit, performing functional testing and parametric control. Parametric control involves measurement of static and dynamic electrical parameters of the microchip, first in laboratory conditions and then under conditions under which tests will be carried out. To compensate for the test conditions effect, the voltage drop on the power supply lines of the TM is continuously taken into account, during the functional testing and the parametric control, the modified with allowance for the length of the information lines of communication of TVFT and TCPV, as well as for automatic compensation of signal delays in information lines of communication, a synchronization line is used.
EFFECT: technical result is broader functional capabilities of the method by increasing the list of destabilizing effects; besides, consideration and compensation of influence of test conditions improves quality of test results.
1 cl, 1 dwg
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Authors
Dates
2019-04-29—Published
2018-06-18—Filed