FIELD: electrical engineering.
SUBSTANCE: invention relates to electronic engineering and can be used in making 3D assemblies with hybrid electronic components. Method of electrical and mechanical connection of boards in 3D electronic assemblies consists in implementation of vertical switching lines due to soldering of mechanically stressed wire with peripheral contact pads of packaged assembly boards passed through end slots of boards in area of these contact pads, as well as by using walls from flexible dielectric material around through rod-shaped guide assemblies, forming volume around electronic components of each level of assembly for pouring compound.
EFFECT: technical result consists in increasing the ratio of payout area of circuit boards for installation of electronic component base (ECB), increasing number of external leads of assembly.
6 cl, 4 dwg
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