FIELD: physics.
SUBSTANCE: invention relates to systems for air cooling of electronic devices, in particular, to cooling method of power semiconductor devices. Technical result is achieved due to that during cooling of power semiconductor devices installed on surface of coolers placed in air duct of electronic device, said coolers are spread along the length of air duct, forming between them zone of mixing of air flows. At that, over at least one cooler is arranged bypass air channel, by means of which supply of cold air to mixing zone is provided and cooling air temperature is lowered at the inlet of the next cooler in direction of air flow movement.
EFFECT: technical result is higher efficiency of cooling of semiconductor devices of electronic device, reduced dimensions of air duct, as well as lower temperature of cooling air at inlet of second in direction of airflow cooler, which leads to rational use of pressure blower.
1 cl, 1 dwg
