FIELD: microelectronics.
SUBSTANCE: invention relates to microelectronics and can be used in designing a radiation-resistant electronic component base. In the method of increasing radiation resistance of microcircuits of static RAM on structures "silicon on sapphire" doping of p-pockets of n-channel transistors, as most sensitive to ionizing radiation, performing two operations of boron implantation through a buffer layer of silicon dioxide with increase of ion energy and implantation of BF2+ ions with minimum energy, providing for channeling of the transistor, subsequent annealing of radiation defects is performed at temperatures from 850 °C to 900 °C, wherein doping doses are selected so that after thermal activation uniform distribution of impurity with concentration in range of 1⋅1017 cm-3 to 3⋅1017 cm-3 in the source p-n junction, doping of capacitor plates is carried out with boron ions to obtain a layer of p-type conductivity, and low-doped regions of sources-effluents are made with ions of phosphorus and boron respectively with doses in range from 3.75⋅1013 ion/cm2 to 4.5⋅1013 ion/cm2.
EFFECT: high levels of radiation resistance of microcircuits of static RAM, made on structures "silicon on sapphire" (SOS), effects of accumulated dose and pulsed ionizing radiation.
4 cl, 2 dwg
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Authors
Dates
2020-07-21—Published
2019-12-27—Filed