FIELD: heat exchange.
SUBSTANCE: invention relates to heat engineering and can be used in electronic equipment cooling systems. Method of cooling electronic equipment with film and droplet flows of liquid is based on movement of a thin liquid film under action of a gas flow in a channel and additional sprinkling of the surface of the electronic component with flows of liquid microdroplets. Mixture of gas and microdroplets of liquid are formed in nozzle device by mixing fluid with flow of fast-moving gas, which is additionally supplied to nozzle device on side of upper cover of channel. Obtained gas mixture and liquid microdroplets are fed to the electronic component such that the surface of the heated electronic component is always coated with a thin liquid film and temperature of heated electronic component does not exceed preset limit temperature to form extended dynamic contact lines gas-liquid-solid body, in which most intensive evaporation is carried out.
EFFECT: technical result is higher efficiency of cooling of high-voltage electronic components.
1 cl, 1 dwg
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Authors
Dates
2020-09-21—Published
2019-12-27—Filed