FIELD: heat engineering.
SUBSTANCE: invention relates to heat engineering and can be used in electronic equipment cooling systems. In the electronic equipment cooling method using combined film and droplet liquid flows, based on the thin liquid film motion due to the gas flow, according to the invention, the drained regions of the electronic component are additionally irrigated by the liquid microdroplets flows with a droplet globule former, located on the upper wall of the channel, above the electronic component regions with the maximum density of the heat flux, wherein the liquid microdroplets outflow is carried out against the direction of gas flow at an angle of 10 to 80 degrees to the direction of gas flow.
EFFECT: technical result is an increase in the electronic components cooling efficiency.
1 cl, 1 dwg
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