METHOD OF COOLING ELECTRONIC EQUIPMENT WITH FILM AND DROPLET FLOWS OF LIQUID USING FINNING Russian patent published in 2019 - IPC F28C3/06 H05K7/20 H01L23/46 

FIELD: heat engineering.

SUBSTANCE: invention relates to heat engineering and can be used in electronic equipment cooling systems. In the method of cooling electronic equipment with film and droplet fluid flows using finning, the surface of the electronic component is irrigated with fluid microdroplets streams using a droplet separator disposed in the upper wall of the channel, surface of electronic component is structured by application of fins of triangular cross-section, oriented along flow, at that, drop splitter is located along entire length of electronic component. Fluid microdroplets are expelled along the tops of the fins so that the droplets falling on the wetted surface of the fins are deformed, forming a significant total length of gas-liquid-solid contact lines and evaporating quickly.

EFFECT: high cooling efficiency of high-voltage electronic components.

1 cl, 2 dwg