FIELD: heat engineering.
SUBSTANCE: invention relates to heat engineering and can be used in cooling systems of electronic equipment. In electronic equipment cooling system using gas flow and combined film and drop flows of liquid, which comprises a flat channel, a substrate, an electronic heat-generating component, a drop former, a flat micro-mini-channel with height of 100–1,000 mcm has an expansion in the area of the electronic component of up to 3–10 mm.
EFFECT: higher efficiency of cooling and critical heat flow due to formation of microdroplet flow and higher accuracy of its focusing.
1 cl, 1 dwg
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