FIELD: technological processes.
SUBSTANCE: invention can be used in soldering of elements from brittle and metal materials, in particular for installation or attachment of a sensor or other electronic device on fragile material, for example, from ceramics, glass or crystalline material. Metallization layer is applied on surface of element made from brittle material. Solder layer is applied between element of metal material and metal coating in boundary area of connection between brittle and metal elements, wherein metallisation layer and solder layer are applied beyond said boundary zone defining zone of stress concentration. Difference in coefficients of thermal expansion of solder and brittle material lead to stresses in cooling process after initial connection.
EFFECT: invention provides reduction of stress level in its concentration range.
17 cl, 7 dwg
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