FIELD: ion-plasma spraying.
SUBSTANCE: invention relates to layout of ion-plasma spraying, vacuum installation for application of coatings and method for implementation of methods for application of coatings by magnetron sputtering with high power pulses. Ion-plasma spraying layout circuit comprises sputtered or partially sprayed cathodes and ion-plasma spraying Gj power generators, Sbj switches on bridge circuit for switching Pj power takeoff of corresponding Gj generator of ion-plasma spraying power and Spi pulse switches for distribution of corresponding Pj power take-offs to corresponding Ti sprayed cathodes. Layout scheme of ion-plasma spraying is made with possibility of its operation in at least two different versions of switching.
EFFECT: technical result is possibility of varying power density of ion-plasma spraying, without leading to loss of efficiency.
17 cl, 7 dwg
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