DEVICE FOR PROTECTING STRUCTURE OF UNCOOLED THERMOSENSITIVE ELEMENT AND METHOD FOR PROTECTING STRUCTURE Russian patent published in 2021 - IPC H01L21/02 

FIELD: microelectronic engineering.

SUBSTANCE: invention relates to the field of microelectronic engineering. The method of protecting a silicon wafer of the structure of an uncooled thermosensitive element from mechanical and / or chemical influences is characterized by the fact that a photoresist layer is applied to the antireflection coating of a germanium plate, the photoresist layer is removed from the edge sections of the antireflection coating or said plate, and the said plate is heat treated with an upper photoresist layer at a temperature 180°C for 3 minutes to evaporate the solvent from the photoresist layer, and then a protective layer of deposited amorphous silicon a-Si with a thickness of at least 2 mcm is applied by the plasmochemical method on the photoresist layer from above and along its side walls.

EFFECT: invention is aimed at increasing the security of the structure of an uncooled thermosensitive element, allowing the structure to be processed in organic solvents.

2 cl, 4 dwg