METHOD OF MAKING SENSITIVE ELEMENTS OF MICROMECHANICAL SYSTEMS Russian patent published in 2012 - IPC H01L21/308 

FIELD: physics.

SUBSTANCE: method of making sensitive elements of micro-electromechanical systems (MEMS) involves applying protective coatings on front and back sides of a wafer, photolithography on the protective layers on the front and back sides, deep high-precision silicon etching on the front and back sides of the wafer at a given depth and with a given profile, removing remaining masking coatings from the front and back sides of the wafer. After etching moats on the front side and removing the remaining protective coating, an operation is performed to deposit onto the silicon wafer a silicon dioxide layer and a profile of etch moats, followed by etching on the back side of the wafer and mechanical fixation of falling out fragments of the structure.

EFFECT: reduced expenses on making MEMS elements compared to when using grown wafers and fewer process operations when making MEMS and high output of suitable elements.

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