MAGNETRON SPUTTERING SYSTEM Russian patent published in 2021 - IPC C23C14/35 

FIELD: microelectronics.

SUBSTANCE: invention relates to a magnetron sputtering system and can be used to obtain coatings from metals, dielectrics, semiconductors, etc. in various industries, including microelectronics. The magnetron sputtering system consists of a vacuum chamber, magnetron sputtering sources placed circumferentially in a vacuum chamber, and a carousel in the form of a drum with substrates, consisting of separate vertically standing plates that form substrate holders. Each of the plates forming the substrate holder is made in the form of two plates fastened in the center opposite to the rotation axis of the carousel. The edges of each of the plates are bent towards the magnetron source and make an angle α between themselves, equal to 160-170°.

EFFECT: design of the magnetron makes it possible to ensure uniformity of the deposited coating in thickness, reduce the consumption of the target material, and increase the number of processed substrates by increasing the linear dimensions of the plates that make up the substrate holder.

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