MAGNETRON SPUTTERING DEVICE Russian patent published in 2022 - IPC C23C14/34 H01J37/34 

FIELD: magnetron sputtering.

SUBSTANCE: invention relates to a device (100) and a magnetron sputtering method. The device contains a substrate (20), an anode (34) in a DC electric field, a target (16) that forms a cathode (30) in a DC electric field and contains an electrically conductive mixture (36) for coating the substrate (20). The target (16) is located in the reaction chamber (10) at a distance from the substrate (20). The voltage source (26) is configured to form a direct current electric field between the cathode (30) and the anode (34). The mixture (36) contains the first material (38) and the second material (40), and the substrate (20) contains the third material (42). The first material (38) is an electrically non-conductive solid, the second material (40) is an electrically conductive solid, the third material (42) is an electrically conductive solid. In accordance with the present invention, the quality of the layer and the properties of the coating layer of the substrate are largely determined by the mechanical and thermal properties of the electrically non-conductive material (first material), while the second material is added to create electrical conductivity.

EFFECT: enabling the substrate to be coated with an electrically non-conductive solid without the anode disappearing effect of DC magnetron sputtering, allowing the substrate to be coated in a simple and economical manner, such as with technical ceramics, which provide numerous useful coating properties.

29 cl, 5 dwg, 2 tbl