FIELD: radio engineering.
SUBSTANCE: invention relates to radio engineering. A symmetrical slot transmission line of the microwave and HF bands contains a slot made in a conductive coating located on one side of a plane-parallel dielectric substrate and a dielectric placed in the slot. The width of the slot is from 0.2 mm to 1.7 mm. The ratio of the width of the slot to the thickness of the substrate is from 0.5 to 3.5. The dielectric placed in the slot completely fills it, while its thickness is no less than the thickness of the conductive coating. The ratio of the dielectric constant of the dielectric filling the slot to the dielectric constant of the substrate material is from 1 to 40. As a dielectric filling the slot, a composition based on solidifying compounds with a dielectric filler with a high degree of adhesion to the dielectric substrate and conductive coatings forming the slot is used. In a symmetrical slot transmission line of the microwave and HF bands, the thickness of the dielectric filling the slot may exceed the thickness of the conductive coating by no more than 0.05 mm, and the excess of the slot width by the dielectric layer over the conductive coating may be no more than 0.2 mm on both sides of the slot.
EFFECT: reduction in the introduced power losses of the transmitted signal, an expansion of the operating frequency range, simplification of the manufacturing technology.
2 cl, 3 dwg
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Authors
Dates
2022-07-29—Published
2021-09-07—Filed