HYBRID INTEGRATED CIRCUIT OF THE MICROWAVE RANGE Russian patent published in 2022 - IPC H01L27/12 

Abstract RU 2777532 C1

FIELD: electronic technology.

SUBSTANCE: invention relates to the field of electronic technology. In the well-known design of a hybrid integrated circuit of the microwave range, which is installed at the bottom of a metal housing with a lid and electrically connected to it, the board is made: with a topological pattern of metallization conductors, at least on one side of each dielectric layer of a multilayer printed circuit board and screen grounding metallization on the reverse side of the lower dielectric layer, with hinged components, including an active generator component, an active control component, and a coaxial dielectric resonator, located on the front side of the upper dielectric layer and electrically connected to its topological pattern of metallization conductors, forming a voltage-controlled generator; the reverse side of the upper dielectric layer of the multilayer board also has a screen grounding metallization, at least on the part occupied by a voltage-controlled generator, the coaxial dielectric resonator has a metallization coating on the side surface, electrically connected to the screen grounding metallization through the topological pattern of the metallization conductors of the upper dielectric layer, and at least one coaxial output on the end surface facing the specified active components, which is electrically connected to the active generator and control components through conductors of the topological metallization pattern, which have capacitive connections in their composition. A part of the topological pattern of the voltage-controlled generator conductors connecting the active generator and control components to the coaxial output of the coaxial dielectric resonator is located on the end surface of the coaxial dielectric resonator and is electrically connected to the film conductors of the topological pattern located on the front side of the upper dielectric layer of the multilayer board, and has capacitive connections in its composition, moreover, the capacitive connection between the end of the film conductor of the connection of the generator component and the coaxial output of the dielectric resonator is made in the form of a gap with a width of 0.14 to 0.18 mm, and the capacitive connection between the side of the film conductor of the connection of the control component and the coaxial output of the dielectric resonator is made in the form of a gap with a width of 0.16 to 0.2 mm.

EFFECT: invention provides an improvement in the electrical and mass-dimensional characteristics of a hybrid integrated circuit of the microwave range.

1 cl, 2 dwg

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RU 2 777 532 C1

Authors

Goryunov Ivan Valentinovich

Iovdalskij Viktor Anatolevich

Tereshkin Evgenij Valentinovich

Fedorov Nikolaj Aleksandrovich

Dates

2022-08-05Published

2021-09-07Filed