HYBRID SHF-BAND INTEGRAL CIRCUIT Russian patent published in 2023 - IPC H01L25/16 

FIELD: electronic engineering.

SUBSTANCE: invention relates to hybrid integrated circuits, for example, an SHF-range generator module. The SHF-range hybrid integrated circuit is made in the form of a multilayer printed circuit board, which is installed at the bottom of a metal case and is electrically connected to it, with attached components, including a generator component, a control component and a coaxial dielectric resonator, a coaxial dielectric resonator, has a metallization coating electrically connected to the ground plating of the board; a hole is made in the printed circuit board, commensurate with the dielectric coaxial resonator located in it; some conductors of the topological pattern of the upper layer of the generator board connecting the active generator and control components with the coaxial output of the coaxial dielectric resonator are located on the end surface of the coaxial resonator, the control component is installed on the metallization of the side surface of the resonator and is electrically connected to it by one grounded output, and its second output connected with a part of the topological pattern of the conductors located on the end surface of the coaxial resonator, and with the topological pattern of the metallization conductors on the front side of the upper dielectric layer of the multilayer board, the capacitive connection between the conductor of the topological pattern of the connection of the generator component and the coaxial output of the dielectric resonator is made in the form of a gap, capacitive coupling between the side of the conductor connection of the control component and the coaxial output of the resonator is made in the form of a gap; the generator component is installed on the plating of the side surface of the resonator from the side opposite to that on which the control component is installed, and is connected to it with one grounded terminal, through attached components connected in parallel to each other, installed on the plating of the side surface of the resonator, its second output is connected to a part of the topological of the conductor pattern on the end surface of the resonator and through a hinged component mounted on a coaxial resonator, it is connected to the conductor of the topological metallization pattern of the upper layer of the printed circuit board, and the third output is connected to the conductor of the topological metallization pattern of the upper layer of the printed circuit board through the hinged component installed on the upper layer of the circuit board.

EFFECT: improvement in the electrical and weight and size characteristics of a hybrid integrated circuit.

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