MICROWAVE HYBRID INTEGRATED CIRCUIT Russian patent published in 2021 - IPC H01L23/00 H05K1/02 

FIELD: electronic engineering.

SUBSTANCE: invention relates to the field of electronic engineering. The design of a microwave hybrid integrated circuit is made in form of a multilayer printed circuit board with a topological pattern of metallization conductors on one side of each dielectric layer and a shield grounding metallization on the reverse side of the lower dielectric layer, with hinged components, a coaxial dielectric resonator. The structure includes a microwave signal processing circuit, including a voltage-controlled generator with a coaxial dielectric resonator included in its circuit. The coaxial dielectric resonator is installed in a hole made in the multilayer board, and the distance between the output of the output of the coaxial dielectric resonator and the place of its connection with the conductor of the multilayer printed circuit board is not more than 1.5 mm. The layers of the multilayer printed circuit board are sampled, the shield grounding metallization is removed on the lower surface of the upper dielectric layer of the multilayer printed circuit board, and the hole in the multilayer printed circuit board is directly connected to the sample.

EFFECT: improvement of electrical and weight and size characteristics of the microwave generator.

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