HYBRID INTEGRATED CIRCUIT OF THE MICROWAVE RANGE Russian patent published in 2022 - IPC H05K1/02 H01L27/12 

FIELD: electronic technology.

SUBSTANCE: invention relates to the field of electronic technology. The hybrid integrated circuit of the microwave range is made in the form of a multilayer printed circuit board, which is mounted on the bottom of a metal housing with a lid and electrically connected to it, the board is made with a topological pattern of metallization conductors on at least one side of each dielectric layer of the multilayer printed circuit board and a screen grounding metallization on the reverse side of the lower dielectric layer; with mounted components, including an active generator component and an active control component located on the front side of the upper dielectric layer, as well as a coaxial dielectric resonator, the terminals of which are electrically connected to the topological pattern of the metallization conductors of the upper dielectric layer of the multilayer board and which together form a voltage-controlled generator; the coaxial dielectric resonator has a metallization coating on the side surface, electrically connected to the on-screen grounding metallization of the board; at least one coaxial output on the end surface facing the specified active components is electrically connected to the active generator and control components through conductors of the topological metallization pattern having capacitive connections in their composition, while a hole is made in the multilayer printed circuit board commensurate with the dielectric coaxial resonator located in it, which is installed at the bottom of the metal housing and is electrically connected to the bottom of the housing by metallization of its side surface; a part of the topological pattern of the voltage-controlled generator conductors connecting the active generator and control components to the coaxial output of the coaxial dielectric resonator is located on the end surface of the coaxial dielectric resonator and is electrically connected to the film conductors of the topological pattern located on the front side of the upper dielectric layer of the multilayer board, and has capacitive connections in its composition, moreover, the capacitive coupling between the film conductor of the connection of the generator component and the coaxial output of the dielectric resonator is made in the form of at least one gap with a width of 0.035-0.055 mm, and the capacitive coupling between the side of the film conductor of the connection of the control component and the coaxial output of the dielectric resonator is made in the form of a gap with a width of 0.16-0.24 mm.

EFFECT: invention provides an improvement in the electrical and mass-dimensional characteristics of a hybrid integrated circuit of the microwave range.

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