METHOD FOR MANUFACTURING A HYBRID INTEGRATED CIRCUIT OF THE MICROWAVE RANGE Russian patent published in 2022 - IPC H01L21/00 

FIELD: electronic technology.

SUBSTANCE: invention relates to the field of electronic technology, namely to methods for manufacturing hybrid integrated circuits, for example, a microwave generator module. The method includes the manufacture of individual dielectric layers of a given sequence of multilayer printed circuit boards with at least one through hole, the manufacture of a given topological pattern of a metallization coating on each of the individual dielectric layers and a screen grounding metallization on the reverse side of at least the lower layer of a multilayer printed circuit board, the formation of at least one through hole in a multilayer printed circuit board by arrangement of separate dielectric layers with simultaneous combination of their through holes, their subsequent connection, placement and fixing of the component in the through hole of a multilayer printed circuit board. The combination of the dielectric layers of the multilayer board is carried out along the pins and base holes. When forming a given sequence of layers, a sample is created in the reverse side of the multilayer board; the dielectric resonator is placed and fixed in the through hole of the multilayer board at the bottom of the housing so that the end of the dielectric resonator with the output is located no more than 0.5 mm from the edge of the hole in the upper dielectric layer of the board, and its coaxial output corresponds in height and location of the connection with the conductor of the topological pattern, and the length of the connection does not exceed 1.5 mm.

EFFECT: increase in the manufacturability, improving the electrical and mass-dimensional characteristics of a hybrid integrated circuit.

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