FIELD: electrical engineering.
SUBSTANCE: invention relates to electrical engineering, specifically to hybrid integrated circuits, for example, a microwave generator module. Result is achieved due to the fact that in the microwave range hybrid integrated circuit the generator component is installed on the dielectric resonator side surface metallization in such a way that it protrudes beyond its end surface, and its second output connected to part of the topological pattern of conductors located on the end surface of the coaxial dielectric resonator is located above the edge of the end surface of the dielectric resonator. Additional hinged component is placed and fixed on the surface of the generator component and is connected between the first and second outputs of the generator component. Hinged component, through which the second output of the generator component is connected to the topological pattern of the upper layer of the multilayer printed circuit board, is located and fixed on the surface of the generator component, and control component is installed on dielectric resonator side surface metallization, in such a way that its second output, connected to a part of the topological pattern of conductors which are located on the end surface of the coaxial dielectric resonator, is located above the edge of the end surface of the dielectric resonator.
EFFECT: improved electrical characteristics of the hybrid integrated circuit.
1 cl, 3 dwg
Title | Year | Author | Number |
---|---|---|---|
HYBRID SHF-BAND INTEGRAL CIRCUIT | 2023 |
|
RU2798048C1 |
METHOD FOR MANUFACTURING HYBRID MICROWAVE INTEGRATED CIRCUITS | 2022 |
|
RU2787551C1 |
HYBRID INTEGRATED CIRCUIT OF THE MICROWAVE RANGE | 2021 |
|
RU2782313C1 |
HYBRID INTEGRATED CIRCUIT OF THE MICROWAVE RANGE | 2021 |
|
RU2778281C1 |
HYBRID INTEGRATED CIRCUIT OF THE MICROWAVE RANGE | 2021 |
|
RU2777532C1 |
METHOD FOR MANUFACTURING HYBRID MICROWAVE INTEGRATED CIRCUITS | 2022 |
|
RU2800495C1 |
METHOD FOR MANUFACTURING A HYBRID INTEGRATED CIRCUIT OF THE MICROWAVE RANGE | 2021 |
|
RU2783368C1 |
MICROWAVE HYBRID INTEGRATED CIRCUIT | 2020 |
|
RU2750860C1 |
MULTILAYER HYBRID INTEGRATED S H F CIRCUIT | 1992 |
|
RU2071646C1 |
MULTILAYER HYBRID MICROWAVE AND EHF INTEGRATED CIRCUIT | 1996 |
|
RU2148874C1 |
Authors
Dates
2024-03-04—Published
2023-09-29—Filed