FIELD: measuring technology and microsystem technology.
SUBSTANCE: invention relates to the field of measuring technology and microsystem technology. Integral micromechanical gyroscope additionally contains eight additional torsion elements made of semiconductor material and located with a gap relative to the substrate along the edges of the inertial mass, four additional fixed electrostatic drive electrodes made of semiconductor material, located directly on the substrate and isolated from each other by an etched channel, additional metal contact pads located on supports and fixed electrodes, four additional movable electrodes of the electrostatic drive made of semiconductor material and located with a gap relative to the substrate, and forming flat capacitors with four additional fixed electrodes of capacitive displacement transducers, as well as an additional layer of semiconductor material, made of silicon oxide.
EFFECT: invention provides the possibility of measuring the values of the angular velocities along the X axis located in the plane of the substrate.
1 cl, 5 dwg
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Authors
Dates
2022-08-22—Published
2021-12-03—Filed