MULTIFUNCTIONAL HIGH-VOLTAGE MODULE Russian patent published in 2022 - IPC H01G2/00 H05K1/02 

Abstract RU 2785912 C1

FIELD: electrical engineering.

SUBSTANCE: invention relates to the field of electrical engineering and can be used in designing high-voltage power sources. The technical result is achieved by the multifunctional high-voltage module being based on a multilayer printed circuit board containing metallised layers and an interlayer dielectric. The metallised layers herein are interconnected alternately by means of metallised through vias. The multilayer printed circuit board also has metallised through mounting and switching holes, each of said holes being connected with the metallised layers thereof. At least one groove is made herein on one side in the outer surface of the multilayer printed circuit board, wherein one or multiple high-voltage cables are placed and secured, the cores of said cables being unsoldered into the metallised through mounting and switching holes. The module additionally comprises electronic components placed on the outer surface on one or both sides of the multilayer printed circuit board. The high-voltage cables and the electronic components herein are placed in a layer of a heat-conducting polymer material.

EFFECT: creation of a multifunctional high-voltage module as a multifunctional radio electronic apparatus providing the possibility of placing radio electronic equipment in a limited volume, electrical strength in a wide range of climatic influences, and overall structural rigidity under mechanical impact in a wide range.

1 cl, 7 dwg

Similar patents RU2785912C1

Title Year Author Number
THREE-DIMENSIONAL ELECTRON MODULE AND PROCESS OF ITS MANUFACTURE 1998
RU2176134C2
MULTILAYER SWITCH-OVER BOARD (OPTIONS) 1998
  • Taran A.I.
  • Ljubimov V.K.
RU2133081C1
MULTILAYER SWITCHING BOARD OF MICROWAVE-HYBRID INTEGRATED MICROCIRCUIT OF SPACE DESIGNATION AND METHOD FOR ITS PRODUCTION (VERSIONS) 2019
  • Poimalin Vladislav Eduardovich
  • Zhukov Andrei Aleksandrovich
  • Kalashnikov Anton Iurevich
RU2715412C1
METHOD FOR MANUFACTURING OF MULTILAYER SUPER-DENSE POPULATED PRINTED CIRCUIT BOARD 2013
  • Stepanov Igor' Ivanovich
  • Pavlov Aleksej Vladimirovich
  • Zarubin Aleksandr L'Vovich
  • Mironova Zhanna Alekseevna
RU2534024C1
LARGE-SCALE INTEGRATED CIRCUIT (VERSION) 1991
  • Barinov Konstantin Ivanovich
  • Vlasov Vladimir Evgen'Evich
  • Volodina Tat'Jana Sergeevna
  • Gorbunov Jurij Ivanovich
  • Masljanyj Anatolij Dem'Janovich
RU2006991C1
MULTIPLE-LAYER CHIP FOR MICROWAVE AND SHORT- WAVE RANGE 1992
  • Iovdal'Skij V.A.
  • Budanov V.N.
  • Jashin A.A.
  • Kandlin V.V.
RU2088057C1
THREE-DIMENSIONAL FLEXIBLE ELECTRONIC MODULE 1997
RU2119276C1
STRONG MULTILAYER PRINTED BOARD, CONTAINING LOW-CUTTING CONTROL CIRCUITS 2015
  • Kuznetsov Anatolij Georgievich
  • Maksimov Aleksandr Viktorovich
  • Melik-Ogandzhanyan Bagrat Parsadanovich
  • Ponomareva Nataliya Borisovna
  • Sharypova Lyudmila Nikolaevna
RU2630680C2
LARGE INTEGRAL CIRCUIT 1990
  • Barinov Konstantin Ivanovich
  • Vasil'Ev Gennadij Fedorovich
  • Vlasov Vladimir Evgen'Evich
  • Gorbunov Jurij Ivanovich
RU2068602C1
SYSTEM FOR HARDWARE PROTECTION OF SENSITIVE DATA PROCESSING ELECTRONIC MODULES FROM EXTERNAL MANIPULATION 2005
  • Vimmer Anton
RU2382531C2

RU 2 785 912 C1

Authors

Grachev Pavel Yurevich

Kabanov Valerij Dmitrievich

Suvorinov Mikhail Ivanovich

Chinyakov Sergej Viktorovich

Frolov Igor Ivanovich

Dates

2022-12-14Published

2021-10-27Filed