FIELD: electrical engineering.
SUBSTANCE: invention relates to the field of electrical engineering and can be used in designing high-voltage power sources. The technical result is achieved by the multifunctional high-voltage module being based on a multilayer printed circuit board containing metallised layers and an interlayer dielectric. The metallised layers herein are interconnected alternately by means of metallised through vias. The multilayer printed circuit board also has metallised through mounting and switching holes, each of said holes being connected with the metallised layers thereof. At least one groove is made herein on one side in the outer surface of the multilayer printed circuit board, wherein one or multiple high-voltage cables are placed and secured, the cores of said cables being unsoldered into the metallised through mounting and switching holes. The module additionally comprises electronic components placed on the outer surface on one or both sides of the multilayer printed circuit board. The high-voltage cables and the electronic components herein are placed in a layer of a heat-conducting polymer material.
EFFECT: creation of a multifunctional high-voltage module as a multifunctional radio electronic apparatus providing the possibility of placing radio electronic equipment in a limited volume, electrical strength in a wide range of climatic influences, and overall structural rigidity under mechanical impact in a wide range.
1 cl, 7 dwg
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Authors
Dates
2022-12-14—Published
2021-10-27—Filed