THREE-DIMENSIONAL STRUCTURE OF PACKAGE BODY FOR RADIO-FREQUENCY MICROSYSTEM AND METHOD OF ITS MANUFACTURING Russian patent published in 2023 - IPC H01L23/55 H01L23/367 

FIELD: radio systems.

SUBSTANCE: group of inventions discloses a three-dimensional design of a package body for a radio frequency microsystem and a method for its manufacture. The three-dimensional structure of the package body of the RF microsystem comprises a body using a package with a ball lead matrix having a square shape, the square body includes a ceramic base, the inner cavity of the square body is formed in the ceramic base, the hole of the inner cavity is not closed; the welded ring is fixedly mounted on a ceramic base. Several layers of protrusions are provided on the four side walls of the inner cavity of the square body; the vertical heat-removing channels are located at the junctions of the protrusions on the two adjacent walls, and the adjacent vertical heat-removing channels are connected by heat-removing connecting materials. A horizontal heat dissipation channel is provided in the centre of the lower surface of the inner cavity; a plurality of central metal holes is formed in each protrusion layer, a plurality of ground holes is formed around each central metal hole, and the ground holes are distributed by taking the centres of the circles of the central metal holes as their centres, the central metal hole and the ground hole are covered with overlays.

EFFECT: high level of integration, good microwave transmission characteristics, possibility of vertical heat removal.

10 cl, 4 dwg