FIELD: electrical engineering.
SUBSTANCE: invention relates namely to a method for producing a protective coating for electronic equipment components using the atomic layer deposition method. The technical result is ensured by forming a conformal protective coating on the surface of a radio-electronic equipment unit with microwave boards by sequentially supplying trimethylaluminium vapour and water of the required dose to a heated to 200°C reactor with an inlet pulse duration of 0.2 s and a duration of removal of excess reaction products for 5 s, while these sequential operations are repeated many times until a protective coating thickness of 30 nm is obtained.
EFFECT: increasing the wear resistance and corrosion resistance of the protective coating, as well as reducing the loss of the transmitted signal.
1 cl, 4 dwg, 1 ex
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Authors
Dates
2024-03-11—Published
2022-10-25—Filed