FIELD: metallurgy.
SUBSTANCE: invention relates to a method of applying materials on a substrate surface and a device for realizing said method. Method of atomic layer deposition of coating on substrate surface includes supply of precursor vapours into reaction chamber of atomic layer deposition device and depositing the material from precursor vapours onto the substrate while moving it inside the reaction chamber while alternating the photon exposure and shading periods. Periods of photon action and shadowing periods are set by means of a shad located between the substrate and the photon source and having areas permeable for photons, and areas not permeable for photons. Shadow region corresponds to the shading period, and the unshadowed region corresponds to the photon exposure period. Apparatus for atom-layer deposition of coating on surface of substrate includes reaction chamber, at least one feed line for supply of precursor vapour to the reaction chamber and shade, located between substrate and source of photons. Said device is configured to deposit material from precursor vapours onto substrate at its movement by acting on substrate inside reaction chamber with vapours of precursors and alternating periods of photon action with shading periods. Shader has areas which are permeable for photons and areas which are not permeable to photons, and with possibility of specifying periods of photon action and shading periods, with ensuring correspondence of the shadow area to the shading period, and of the unshadowed region to the photon exposure period.
EFFECT: relatively high rate of growth of the deposited coating and possibility of self-limited growth of said coating.
11 cl, 7 dwg
