FIELD: non-destructive testing.
SUBSTANCE: invention relates to non-destructive quality control methods of components of electronic equipment and can be used for rejection of thin-film resistors. Method of rejecting potentially unreliable thin-film resistors involves exposure to high-frequency oxygen plasma at specific energy of 20 to 50 mWt/cm3 for 10 to 20 minutes. Potentially unreliable resistors are identified from the difference in layer resistances of the layer before and after treatment.
EFFECT: reduced labor input with possibility of detection of potentially unreliable resistors at early stage of their formation.
1 cl, 1 dwg
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