FIELD: gas-discharge electronics. SUBSTANCE: back and target to be sprayed are positioned in a closed space of gas absorber or getter pump which is not sprayed. Prior to ionic treatment in the growth compartment positioned in the getter pump zone the pressure is lowered by two orders from the pressure in the vacuum chamber. Coatings are applied through spraying the target by a flow of inert gas ions. The surfaces of the target and back also accept 10-8-10-4 Pa/cm2 molecular flows of reactive gases. EFFECT: obtaining films of preset stoichiometric properties; increased output of process. 2 dwg
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