METHOD FOR FORMING METALLIC PLATING ON DIELECTRIC SURFACE Russian patent published in 1995 - IPC

Abstract SU 1814818 A3

FIELD: plating with metals. SUBSTANCE: method for applying metal platings on dielectric surface includes its surface activation and reducing precipitation of metals from aqueous solutions of their salts, with activation being carried out applying island-like hydrogen getters at hydrogen pressure not exceeding 10-5 Pa. Precipitation is carried out from solutions saturated by hydrogen. EFFECT: increased specific surface of the plating.

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SU 1 814 818 A3

Authors

Tuleushev A.Zh.

Mukhamedshin I.Sh.

Volodin V.N.

Dates

1995-05-10Published

1990-12-25Filed