FIELD: microelectronics. SUBSTANCE: process is related to technology of precipitation of silicon dioxide films from gas phase and may find use in manufacture of superlarge-scale integrated circuits. Prior to precipitation reactor is blown through with nitrogen monoxide under pressure 40-266 Pa in the course of 3-20 min. Thermal treatment of films in oxygen is conducted after precipitation. EFFECT: improved quality of films due to reduced presence of flaws and enhanced electric strength. 1 tbl
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Authors
Dates
1996-11-27—Published
1990-05-15—Filed